Hi Rel Lids design components and specialist materials to the Micro and Opto Electronics Market Choose Fortex Laminators

Hi Rel Lids who are part of the Global Hi Rel Group of Companies which includes Hi Rel Alloys (Canada) and Hi Rel Products (USA)  use a range of Dry Film Roll Laminators as part of their manufacturing process for the production of components and specialist materials for the Mirco and Opto Electronics Markets.  Due to increased demand Hi Rel Required additional throughput in their manufacturing facility and required an additional Dry Film Roll Laminator.  After an onsite demonstration of the Fortex Dry Film Roll Laminator Model 305 Hi Rel were impressed with the performance and features of the Machine as well as the UK based back up of, off the Shelf Spares for the machine.

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Fortex Celebrates the Award of Contracts to Equip Two Leading Indonesian Universities

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Fortex is pleased to have worked in conjunction with their Indonesian Agent in successfully tendering for the award of two contracts to supply two leading universities with Photoplotter Equipment for the Production of Photo tools and Dry Film Hot Roll Laminators for applying Dry Film to various Laminate substrates.  Indonesia which has a population of over 240 million people currently has the largest economy in Southeast Asia and has the 4th largest population in the world with current growth of 6.5% per year.  Indonesia is currently investing heavily in its Educational Institutions with a particular emphasis towards the teaching of Electronics Engineering and manufacturing.

Fortex was successfully awarded these contracts due to their in depth technical presentations at the tendering stages, and their offer of on site installation, commissioning and training in these two technologies.

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BAE British Aerospace turns to Fortex for a solution to apply Photoresist to larger silicon wafers

Fortex was pleased to be approached by the Military Air and Information unit (MAI) of BAE British Aerospace for a solution to apply Photoresist to its larger wafers.

Tanya Ferris Research Engineer  at the BAE Advanced technology centre commented “BAE systems has used spin coating as its primary method of applying Photo resist to its wafers for manufacture of a range of MEMS Sensors, actuators and display devices. However the large topography on some device structures means that spin coat resist is not always the best solution. BAE Systems has selected the Fortex Model 305 Dry Film Roll Laminating machine as an alternative method of applying the resist to silicon wafers as the technique is very effective at tenting over holes and areas of high topography on the wafer. BAE Systems has established process conditions where silicon wafers can be processed through the laminator originally designed for PCB substrates.”

 

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