Batch Reflow Oven Model RF100

£899.00

The RF100 Batch Reflow oven is a  practical reflow oven for manufacturing and reworking of SMT products using SMD . The Batch reflow oven has a large display. The intuitive menu navigation is controlled by a membrane keyboard. This batch reflow oven uses highly efficient infrared heating elements and has several thermocouple temperature gauges. Due to this and the precise evaluation in the microprocessor, the temperature curve of the reflow process is highly accurate and the temperature in the respective reflow sections very uniform.

The RF100  Batch Reflow oven is a  practical reflow oven for manufacturing and reworking of SMT products. The oven has a large display. The intuitive menu navigation is controlled by a membrane keyboard. The product uses highly efficient infrared heating elements and has several thermocouple temperature gauges. Due to this and the precise evaluation in the microprocessor, the temperature curve of the reflow process is highly accurate and the temperature in the respective reflow sections is very uniform.

With the RF100 Batch PCB Solder Reflow oven all common high temperature alloys, including lead free can be processed to faciliate the mounting of SMD (Surface Mount Devices). The Reflow oven has an automatic error detection with alarm.

This product has a variety of applications such as reflow soldering, repairing, drying and so on. It is suitable for SMT small series, for research and development of electronic products, school, education and study.

The Batch Reflow stove is well insulated by a special aluminum silicate cotton, which reduces energy consumption, protects the circuit and allows optimal operation and keeps the temperature in the furnace constant.

 

Technical Specifications

 

Power connection 200 – 230 VAC. / 50-60Hz
Max. Power Consumption 2400 W
Max. PCB-Board Size 350 x 300 mm
Time Settings

 

00:00 – 99:59 sec.

 

Temperature 60 -300 °C
Setting Options 5 Phases adjustable in time and temperature:

Preheat

Heat

Soldering

Holding

Cool down

Working Modes Automatic Reflow-Soldering

Permanent Heating or Drying function

Option to store 4 different Reflow profiles

Interface Graphic display with Keyboard automatic Alarm function

Display of Process progress

Heatup Time Approximately 8 min
Dimensions (LxWxH) (mm) 504 x 500 x 314 mm
Weight 28 kg