The RF100 Batch Reflow oven is a practical reflow oven for manufacturing and reworking of SMT products. The oven has a large display. The intuitive menu navigation is controlled by a membrane keyboard. The product uses highly efficient infrared heating elements and has several thermocouple temperature gauges. Due to this and the precise evaluation in the microprocessor, the temperature curve of the reflow process is highly accurate and the temperature in the respective reflow sections is very uniform.
With the RF100 Batch PCB Solder Reflow oven all common high temperature alloys, including lead free can be processed to faciliate the mounting of SMD (Surface Mount Devices). The Reflow oven has an automatic error detection with alarm.
This product has a variety of applications such as reflow soldering, repairing, drying and so on. It is suitable for SMT small series, for research and development of electronic products, school, education and study.
The Batch Reflow stove is well insulated by a special aluminum silicate cotton, which reduces energy consumption, protects the circuit and allows optimal operation and keeps the temperature in the furnace constant.
|Power connection||200 – 230 VAC. / 50-60Hz|
|Max. Power Consumption||2400 W|
|Max. PCB-Board Size||350 x 300 mm|
|00:00 – 99:59 sec.
|Temperature||60 -300 °C|
|Setting Options||5 Phases adjustable in time and temperature:
|Working Modes||Automatic Reflow-Soldering
Permanent Heating or Drying function
Option to store 4 different Reflow profiles
|Interface||Graphic display with Keyboard automatic Alarm function
Display of Process progress
|Heatup Time||Approximately 8 min|
|Dimensions (LxWxH) (mm)||504 x 500 x 314 mm|