Infared + Air circulation + Air cooling, Pb-free Reflow Oven
• Surface mounting of units on boards require the exposure of the device package to high temperature to melt the solder finish for board soldering. A lot of the alternative “lead-free” solder materials being considered for use in IC assembly today require a peak soldering temperature of about 250 to 260 deg C, versus the peak temperature
of 230 to 235 deg C for Sn-Pb solder. This means that lead-free IC’s will need a higher temperature for board mounting, and will therefore be subjected to more severe thermo-mechanical stresses during the process.
• This Oven feature a complete system for today’s solder/ Pb-Free solder(260C) requirement. The computer control 20 step range (20 Zone) temperature control allow a smooth and well control temperature curve. High power heating element with force air heating method provide a very even soldiering hot zone across the total
soldiering area, This cost effective unit offer high production count ( 4~5 mins per cycle of 300mm x 220mm board) which ideal for low to medium size of SMD production. The static soldering process offer very stable non
moving especially important for fine pitch SMD soldering.
• Infrared Array + Force Air ( high volume, low pressure ) Heating Method.
• Programmable 20 step control for temperature curve setting.
• Internal cooling fan for fast Cool down performance.
• Fully Automatic, fully static ( non moving rail) operation, single or double side board soldering.
• Large transparent glass window see throught the soldering process with high temperature build in 35W light
( separated ON/OFF) switch.
• Internal complete high gloss stainless steel construction, high IR efficiency and easy to clean, maintenance.
• Ball bearing Rail draw system for stable solider board exchange with minimum vibration.
• Optional PCB tray for quick exchange between the board process.
• Top Open design for quick access to heating element and service.
• Dual channel air circulation. For fast cool down process.
• Maximum heating area: 320mm x 220mm
• Interchangeable tray for continuous process.
• Maximum Temperature: 290C
• Operation environment: 0-40C
• Maximum Power comsumption: 3.5kW, 1kW Typ.
• Weight: 30kg gross, 40 kg ship
• Dimension: 490mm x 450mm x 345mm
• Input Voltage: 220V single phaseHigh quality Programmable Reflow oven suitable for Lead free SMT circuits, with a heating area maximum of 320 x 220mm and a maximum height of 35mm