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Programmable Reflow Oven Model RF460

Programmable Reflow Oven Model RF460


The RF460 is a high quality Programmable Reflow oven suitable for Lead free SMT circuits, with a heating area maximum of 460 x 460mm and a maximum height of 35mm

Order Code: OV-RF460. Categories: , .


  • Technical data
  • Infrared + Air circulation + Air cooling, Pb-free Reflow Oven
  • Surface mounting of units on boards require the exposure of the device package to high temperature to melt the lead finish for board soldering. A lot of the alternative “lead-free” solder materials being considered for use in IC assembly today require a peak soldering temperature of about 250 to 260 deg C, versus the peak temperature of 230 to 235 deg C for Sn-Pb solder. This means that lead-free IC’s will need a higher temperature for board mounting, and will therefore be subjected to more severe thermo-mechanical stresses during the process. This Oven feature a complete system for today’s solder/ Pb-Free solder(300C) requirement. The temperature is controlled by a microcontroller. The Reflow Oven RK460 has a USB interface. It is possible to connect an external PC. The temperature curves can be drawn in the graphic mode and the real temperatures shown on the monitor.. High power heating element with force air heating method provide a very even soldiering hot zone across the total soldiering area, This cost effective unit offer high production count ( 4~5 mins per cycle of 460mm x 460mm board) which ideal for low to medium size of SMD production. The static soldering process offer very stable non moving especially important for fine pitch SMD soldering.
  • Features:
  • Infrared Array + Forced Air ( high volume, low pressure ) Heating Method.
  • Free programmable control for temperature curve setting.
  • Internal cooling for fast cool down performance.
  • Fully Automatic, fully static ( non moving rail) operation, single or double side board soldering.
  • Large transparent glass window see throught the soldering process with high temperature build in light .
  • Internal complete high gloss stainless steel construction, high IR efficiency and easy to clean, maintenance.
  • Ball bearing Rail draw system for stable solider board exchange with minimum vibration.
  • Optional PCB tray for quick exchange between the board process.
  • Top Open design for quick access to heating element and service.
  • Dual channel air circulation. For fast cool down process.
  • USB interface
  • Specifications:
  • Maximum heating area: 460mm x 460mm
  • Interchangeable tray for continuous process.
  • Maximum Temperature: 300C
  • Power supply: AC 380V/ 50-60Hz
  • Maximum Power consumption: 4800 W.
  • Weight: 55kg
  • Dimension: 680 x 630 x 305 mm