A high quality FR4 Uncoated Double Sided Copper Clad Laminate material ideal for the production of high quality printed circuit boards with CNC Routing Drilling Machines, Dry Film Laminators, Screen Printed Resists, LDI Laser Direct Imaging. All laminate manufactured and tested in accordance with IPC4101C/21
By special request the material can be cut to any required size.
|Copper foil||35 micron/1oz|
|Solderbath resistance (260°C)||20 secs|