Dry Film Solder Mask negative working, 75 Micron (3 Mils) Thick (A 40um thick version is available by request). Application of a Dry Film solder mask (DFSM) gives the Printed Circuit Board (PCB) fabricator the following advantages:-
-Protection against oxidation of Printed circuit board
-Prevents solder bridges forming between closely spaced solder pads
-Provides electrical insulation allowing higher voltage traces to be placed closer to one another.
This Dry Film Solder Mask (DFSM) is an aqueous processible, dry film photopolymer solder mask, utilizing epoxy chemistry materials well known for their electrical insulation,chemical resistance and dimensional stability properties. Key performance properties include:
• Compatible with No Clean and aqueous based fluxes and Solder Pastes.
• Wide process latitude.
• Scratch resistant flexible film which improves via hole tenting integrity.
• Excellent resolution capabilty.
• Low tendency for light bleed.
• Utilizes epoxy based chemistry for excellent physical, chemical mechanical and electrical resistance properties.
• Meets or exceeds the requirements of IPC SM840C Class T & H, Mil P55110D and Bellcore requirements.
This Dry film Solder mask is a transparent, high gloss forest green material which is supplied in thicknesses of 75 microns (3mils) Like most other dry film products the photopolymer is sandwiched between a 25 micron(1.0mil) polyester support sheet and a 25 micron (1mil) polyethylene release sheet..
Application: This DFSM is recomended for use on rigid printed wiring boards, epoxy or polyimide laminates, and performs well on a variety of metallic circuitries such as, copper, tin lead,bright acid tin, nickel and gold. This DFSM is compatible with most soldering operations,such as, Hot Air Solder Levelling, Wave Soldering,Vapour phase and Infra Red soldering.
This DFSM will withstand most solvent and aqueous defluxing media. Due to the Dry Film Soldermask high resolution characteristics, straight sidewall via holes tenting, chemical and thermal resistance properties, the DFSM product is ideally suited for use on high density surface mount technology (SMT) printed wiring board designs. This DFSM is designed for use on rigid printed wiring boards and is not recommended for use on flexible circuits.
The DF501 Dry Film Solder Mask Film can be Laminated to the PCB substrate using one of the Fortex Dry Film Laminators.
With an artwork Phototool an exposure is made using a UV exposure unit and the unwanted areas are developed away using a Dry Film Developer solution before final curing in an Oven/UV Exposure Unit