Technology Transfer Agency TECHTRA is established as a consulting, managing and production company working with the high technology industry and research centers throughout Europe.
Techtra have an ongoing collaboration with European Institute for Nuclear Research (CERN) carry out research work. As part of this work Techtra required a large industrial commercial grade double sided UV Exposure unit with a vacuum.
Most of the activities at CERN currently involve operating the Large Hadron Collider (LHC), and the experiments for it. The LHC represents a large-scale, worldwide scientific cooperation project.
The LHC tunnel is located 100 metres underground, in the region between the Geneva International Airport and the nearby Jura mountains. It uses a 27 km circumference circular tunnel The Large Hadron Collider (LHC) is the world’s largest and most powerful particle collider, the largest, most complex experimental facility ever built, and the largest single machine in the world
Fortex were pleased too supply Abbotts with a customised spray developing machine to aid in the production of probes. The probes are used in meters for monitoring people with Diabetes Blood Glucose Levels.
The customised conveyorised developing machine features a bespoke length developing chamber with temperature and pressure monitoring systems that automatically shut the developing machine down if certain operating parameters are out of tolerance. The CP300DS double sided spraying machine also featured re circulating rinse, mains water rinse and blow dry facilities. The same machine can also as a conveyorised spray Etcher.
Fortex was pleased to be approached by the Military Air and Information unit (MAI) of BAE British Aerospace for a solution to apply Photoresist to its larger wafers.
Tanya Ferris Research Engineer at the BAE Advanced technology centre commented “BAE systems has used spin coating as its primary method of applying Photo resist to its wafers for manufacture of a range of MEMS Sensors, actuators and display devices. However the large topography on some device structures means that spin coat resist is not always the best solution. BAE Systems has selected the Fortex Model 305 Dry Film Roll Laminating machine as an alternative method of applying the resist to silicon wafers as the technique is very effective at tenting over holes and areas of high topography on the wafer. BAE Systems has established process conditions where silicon wafers can be processed through the laminator originally designed for PCB substrates.”